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Zurück zum Zitat Huo F, Kang R, Li Z, Guo D (2013) Origin, modeling and suppression of grinding marks in ultra-precision grinding of silicon wafers. Int J Mach Tool Manu 66:54–65. https:// doi. org/ 10. 1016/ j. ijmachtools. 2012. 11.
The grinding technology for advanced materials such as optical glass, WC, ceramics and silicon has substantially grown with the widespread use of precision components made of such materials in various applications like micro lenses, semiconductor components, automobile diesel injectors, and magnetic heads for computers etc. Applications of ...
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Grinding marks are regard as a great obstacle to manufacture spherical and aspheric surfaces with higher surface quality, lower energy and wastage. The scallop-height was studied for optimizing the grinding parameters firstly to reduce its effect on grinding marks. Secondly, the expression of grinding points distribution was established to characterize the grinding marks …
Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers FW Huo, RK Kang, Z Li, DM Guo International Journal of Machine Tools and Manufacture 66, 54-65, …
Keywords: Ultra-precision, Grinding, Chemical action assistance : Abstract : Higher accuracy and more efficient production of large aperture glass lenses is increasingly required for high-resolution imaging devices. These glass lenses are typically manufactured by both ultra-precision grinding and polishing.
Kuroda Precision Industries ltd. KURODA HISTORY 90 information. Kuroda Precision Industries is manufacturer of precision equipments and machines of Japan. We manufacture such as Precision Ball Screws,Ballscrew Actuators,Press Tools,Surface Grinding Machine,Gauges,Ultra Precision Surface Configuration Measuring systems and etc.
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[204]Gao, Shang,Dong, Zhigang,Kang, Renke,Guo, Dongming.Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2013,227(B4):578-586
Huo, FW, Kang, RK, Li, Z, et al. Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. Int J Mach Tools Manuf 2013; 66: 54 – 65. Google Scholar | Crossref
An advanced polishing technique of ion polishing has been used to process silicon wafers. This high-level stability and the precision process can achieve the roughness Ra 0.231nm at the finishing optical surfaces. Preview abstract
High-precision optical components with complex shapes or microstructures have been extensively used in numerous fields such as biomedicine, energy and aerospace. In order to accurately achieve the specific functions of the components, the form accuracy and uniform surface quality need to reach an ever-high level. To achieve this, ultra-precision normal grinding is used for machining …
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Silicon is the primary semiconductor material used to fabricate integrated circuits. The quality of microchips depends directly on the quality of silicon wafers. A series of processes are required to manufacture the high-quality silicon wafers. Chemical mechanical polishing is a necessary step to achieve the required wafer flatness.
When the existing analytical models are used to predict the gain depth-of-cut in ultra-precision grinding process of silicon wafer, the results obtained become unreasonable due to an extremely shallow grain depth-of-cut, which is inconsistent with the theory of the contact mechanics.
Recently the design of a Laue lens with field of view of 30 arcseconds and for x-rays in the energy range from 100 keV to 1 MeV has been proposed in which mosaic crystals are used as focussing elements. The proper mosaic angular spread is chosen as a compromise between intensity and energy resolution of …
An experimental investigation into micro ball end-milling of silicon. By Muhammad Arif Rahman. Analytical modeling of ductile-regime machining of tungsten carbide by endmilling. By Muhammad Arif. A review on the current research trends in ductile regime machining. By M. Rahman and dennis Neo.
Abstract: The effective estimation of the operational reliability of mechanism is a significant challenge in engineering practices, especially when the variance of uncertain factors becomes large. Addressing this challenge, a novel mechanism reliability method via a two-dimensional extreme distribution is …
Modeling of Vibration Condition in Flat Surface Grinding Process › journals by A Gasagara - 2020 Feb 10, 2020 - This article presents a new model of the flat surface grinding process vibration conditions.
The rotation speed ratio (RSR) is an important parameter influencing the surface waviness features in the parallel grinding process, which equals the ratio of the grinding wheel's rotation speed N g and the workpiece's rotation speed N w, as described in Equation (3) [].When RSR is integer, the peaks and valleys of the circular waviness profiles generated during all the revolutions of the ...
Study of the effects of laser micro structuring on grinding of silicon nitride ceramics: Bahman Azarhoushang, Babak Soltani, Amir Daneshi / Goverdham D. Lahoti (1) STC G, 67/1/2018, P.329 : Keywords: Laser assisted grinding, Silicon nitride, Specific grinding energy, Ultra-short pulsed laser, Laser energy, Single grain cutting
Origin, modeling and suppression of grinding marks in ultra-precision grinding of silicon wafers International Journal of Machine Tools and Manufacture Mar 2013 A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to ...
19. D.M. Guo, F. Ren, Y.W. Sun. An approach to modeling cutting forces in five-axis ball-end milling of curved geometries based on tool motion analysis. ASME Transaction：Journal of Manufacturing Science and Engineering, 2010, 132(4): 041004-041004-8. ... D.M. Guo. Origin, modeling and suppression of grinding marks in ultra precision grinding ...
Huo F W, Kang R K, Li Z and Guo D M 2013 Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers Int. J. Mach. Tool Manuf. 66 54–65 Crossref Google Scholar [158]
About. CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems.This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers.
[11] HUO F W, KANG R K, LI Z, et al. Origin, Modeling and Suppression of Grinding Marks in Ultra Precision Grinding of Silicon Wafers[J]. International Journal of Machine Tools and Manufacture, 2013, 66:54-65. [12] SUN W, PEI Z J, FISHER G R. Fine Grinding of Silicon Wafers:Effects of Chuck Shape on Grinding Marks[J].
Silicon wafers are used for production of most microchips. Various processes are needed to transfer a silicon ingot into wafers. With continuing shrinkage of feature sizes of microchips, more stringent requirement is imposed on wafer flatness. Fine grinding of silicon wafers is a patented technology to produce super flat wafers at a low cost.
Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness.
High-precision optical components with complex shapes or microstructures have been extensively used in numerous fields such as biomedicine, energy and aerospace. In order to accurately achieve the specific functions of the components, the form accuracy and uniform surface quality need to reach an ever-high level. To achieve this, ultra-precision normal grinding is used for machining various ...
This phenomenon, which is typical in turbomachinery, is referred to as ice shedding. The ice shedding phenomenon is very complicated because there are several unknown physical properties of ice, such as the ice density, the adhesion force between accreted ice …
Subsurface damage (SSD) and grinding damage-induced stress (GDIS) are a focus of attention in the study of grinding mechanisms. Our previous study proposed a load identification method and analyzed the GDIS in a silicon wafer ground (Zhou et al., 2016, "A Load Identification Method for the GDIS Distribution in Silicon Wafers," Int. J. Mach. Tools Manuf., 107, pp. 1–7.).
Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness.
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